SDINADF4-32G-H Specialized Programming Module for eMMC devices in BGA153 packag

Part Number: AP3 BGA153-1.01 eMMC-1

Ord. no. 73-3040
Socket ZIF BGA153, open top type
Bottom 2 connectors by 68 pins, receptacle type
Class Specialized
Subclass Memory (NOR/NAND/eMMC)

Device: SDINADF4-32G-H [FBGA153]
Manufacturer: SanDisk

Module manual

Protect the contacts of module's connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
Proceed with care! Incorrect insertion of device in module's ZIF socket may lead to programmed device damage.

Unscrew knurled thumb screw. Insert programming module into Programming Module Interface connectors, until it clicks. Due to connectors shape, only one orientation and position of programming module in Programming Module Interface connectors is possible. Screw knurled thumb screw to fix programming module to programmer.
Push the cover of module's ZIF socket (the topmost movable part) to open the socket. Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed. Then release module's ZIF socket.
The cover must be fully actuated (depressed) before inserting a device into the socket.
Do not press on device while inserting it and/or releasing the cover.
Visually check the placement of programmed device in module's ZIF socket. If everything looks OK, the device is ready for programming.
To take out the device from module, push the cover of module's ZIF socket and remove the device.
When you finish the work with module, unscrew knurled thumb screw and remove the module from Programming Module Interface connectors.

Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing